COOL OPTIONS, INC.
Patent Owner
Stats
- 2 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Mar 15, 2016 most recent publication
Details
- 2 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 230 Total Citation Count
- Nov 29, 2000 Earliest Filing
- 19 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2007/0125,274 THERMALLY CONDUCTIVE GROUT FOR GEOTHERMAL HEAT PUMP SYSTEMSAbandonedNov 30, 06Jun 07, 07[C04B]
2007/0080,162 THERMALLY CONDUCTIVE RESIN ARTICLE FOR FOOD CONTACT AND FOOD PROCESSING AND METHOD FOR MANUFACTURING SAMEAbandonedOct 11, 06Apr 12, 07[B65D]
2007/0045,823 THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICSAbandonedAug 25, 06Mar 01, 07[H01L]
7132071 Method of molding using a plunger machine with a tapered boreExpiredJul 01, 04Nov 07, 06[B29C]
2006/0231,231 METHOD OF TWO SHOT MOLD METALLIZING OF POLYMER COMPONENTSAbandonedApr 19, 06Oct 19, 06[B22D]
2006/0135,655 Method for improving filler dispersal and reducing tensile modulus in a thermally conductive polymer compositionAbandonedDec 07, 05Jun 22, 06[C08J]
2005/0110,380 Method for making thermally-conductive plastic articles having light reflecting surfacesAbandonedDec 16, 04May 26, 05[H01K]
2004/0265,558 Thermally conductive carbon fiber extrusion compounderAbandonedJul 21, 04Dec 30, 04[B32B]
2004/0226,707 Method of manufacturing an elastomeric heat sink with a pressure sensitive adhesive backingAbandonedMay 20, 04Nov 18, 04[F28F, B21D]
2003/0040,563 Substantially non-abrasive thermally conductive polymer composition containing boron nitrideAbandonedAug 22, 02Feb 27, 03[C08K]
2002/0180,095 Thermally conductive carbon fiber extrusion compounder and method of using sameAbandonedMay 29, 02Dec 05, 02[B29C]
2002/0062,949 Overplated thermally conductive part with EMI sheildingAbandonedNov 29, 00May 30, 02[F28F]
2001/0049,028 Metal injection molding material with high aspect ratio fillerAbandonedJan 10, 01Dec 06, 01[B32B]
2001/0045,297 Molding of electrical devices with a thermally conductive and electrically insulative polymer compositionAbandonedJan 31, 01Nov 29, 01[H01L, H05K]
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